Look to KAIJO for speed, fine pitch, and high
accuracy. Kaijo is the pioneer of high performance, intelligent machines.
Utilizing the most modern bonding techniques, KAIJO wire bonders respond to your
needs for unlimited fine pitch applications. KAIJO wire bonders offer high
quality and high reliability in support of automation in the semiconductor
industry.
HYPER SOLUTION
FOR WIRE BONDING
Low inertia linear motor bonding head
Latest Ultrasonic generator
High speed high accurate AC servo driven XY table
Sophisticated pattern recognition unit Each of these features combined
is what enables the KAIJO wire bonders to achieve the finest and fastest bonding
available in todays market.
WIDE RANGE OF
APPLICATIONS
Over 30 years of experience coupled with a world
wide customer base have given KAIJO the chance to work on a variety of
applications and products.
WIDE AREA
BONDING
Equipment is available for HIC, COB and other bonding
conditions which require wider bonding areas.
